
Analysis of Thermal Comfort of Clothing with Different Textile Material through Thermal Simulation - 19.127
M. Awais et al., "Analysis of Thermal Comfort of Clothing with Different Textile Material through Thermal Simulation", in Proc. of 3DBODY.TECH 2019 - 10th Int. Conf. and Exh. on 3D Body Scanning and Processing Technologies, Lugano, Switzerland, 22-23 Oct. 2019, pp. 127-136, doi:10.15221/19.127.
Title:
Analysis of Thermal Comfort of Clothing with Different Textile Material through Thermal Simulation
Authors:
Muhammad AWAIS, Ellen WENDT, Sybille KRZYWINSKI
TU Dresden, Institute of Textile Machinery and High-Performance Material Technology, Germany
Abstract:
Thermophysiological comfort is one of the most important aspects of wear comfort. Currently, there are no software solutions available for the combined consideration of material characteristics, fit and thermophysiological behavior. Thus, a laborious empirical process is typically required to determine an appropriate design matching new textile materials for pattern cuts as well as changing climatic conditions. A detailed wear trial in a climatic chamber supports this process. The objective of this research is to analyze the thermal comfort of clothing with different thermal characteristics through the simulation of heat regulation in the human body, microclimate, clothing, and environment.
Details:
Full paper: 19127awais.pdf
Proceedings: 3DBODY.TECH 2019, 22-23 Oct. 2019, Lugano, Switzerland
Pages: 127-136
DOI: 10.15221/19.127
License/Copyright notice:
Proceedings: © Hometrica Consulting - Dr. Nicola D'Apuzzo, Switzerland, hometrica.ch.
Authors retain all rights to individual papers, which are licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
The papers appearing in the proceedings reflect the author's opinions. Their inclusion in the proceedings does not necessary constitute endorsement by the editor or by the publisher.
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